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This paper presents a dielectric waveguide based multi-mode sub-THz interconnect channel for high data-rate high bandwidth-density planar chip-to-chip communications. By using a proposed new transition of microstrip line to dielectric waveguide, the interconnect channel achieves wide bandwidth on two orthogonal modes Ey11 and Ex11. To the authors' knowledge, this is the first demonstration of a multi-mode...
This paper presents a high energy-efficiency and high bandwidth-density dielectric waveguide based sub-THz interconnect. A bumpless flip-channel packaged nearfield coupled transition based channel together with the holistic active circuit design scheme boosts the energy efficiency to the record based on the authors' best knowledge. The channel demonstrates the transmission loss of 0.04 dB/mm and the...
This paper presents sub-THz interconnect for high energy-efficiency chip-to-chip communications, including a microstrip line based low-loss wideband sub-THz channel and a high energy-efficiency transceiver. The channel loss is as low as 0.06 dB/mm. The transmitter output power is 0.66 dBm with 8.8 mW of DC power consumption, and the receiver consumes 60.8 mW DC power. The interconnect achieves 9-Gb/s...
This article presents the dielectric waveguide based sub-THz interconnect channels for high bandwidth-density and high energy-efficiency chip-to-chip communications. Both far-field and near-field transition based channels are analyzed and demonstrated. The insertion losses of the interconnect with far-field transitions and near-field transitions are about 8.4 dB with 12.6 GHz 3-dB bandwidth and 4...
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