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The electrochemical deposition of copper in reduced polyaniline (PAN) films is studied at different polymer layer thicknesses. A saturation in the number density, n 0 , of active sites for metal deposition is found at 0.5 μm PAN thickness (n 0 =10 8 cm -2 ). The surface spatial distribution of the deposited copper crystals is analysed in two cases. It is found...
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