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In this paper, the model of BGA solder joints were established by the finite element method (FEM). It would reflect the variations of creep stain in solder joints more truly by the cyclic temperature loading. The results are as follows: when the BGA solder joints subjected to cyclic thermal loading, the equivalent creep strain move to the center of solder joints gradually with the increase of the...
With the decrease of the size of lead-free solder joints, the reliability of solder joints is particularly prominent, which is critical to the mechanical behavior of solder joints. While in the actual production process, the stresses for solder joints are often complex. In this paper, the nano-indentation is used to obtain the mechanical behaviors and the step behaviors of Sn3.0Ag0.5Cu and Sn0.3Ag0...
The reason for the PCB warpage is the mismatch of the thermal expansion coefficient between different components materials, which leads to stress in the interconnected solder joints of components. In this paper, we used the finite element method (FEM) to investigate the PCB warpage in the CuCGA interconnection structure in the process of thermal cycle and the influence of copper columns aspect ratio...
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