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With the rapid development of electronic technology, semiconductor section resistivity measurement is receiving increasing attention. This paper applies electrical impedance tomography (EIT) technology to semiconductor resistivity measurements. FEM is applied to solve the EIT forward problem. Mathematical description of partial differential equation, equivalent variation differential problem, element...
Digitized-die forming (DDF) is a rapid and flexible manufacture technology for sheet metal parts. An integrated method is developed in the paper, through which the digitized-die geometry can be directly generated from the measured data of a desired part. The method involves two steps, in the first step, based on the theory of optimal approximation and energy smoothing principal, a positive definite...
Multi-point forming (MPF) is a novel manufacturing technique for three-dimensional sheet metal. The discrete punches are composed of a pair of reconfigurable MPF dies and the shapes of the dies can be changed with requirement during the process of sheet forming. In this paper, three key problems concerning the control of the MPF process are discussed and the relevant numerical approaches are presented...
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