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The ECD have been considered critical process for PCB industry, yet the catalysts with high performance are of great importance in this process. In this work, PdCu bimetallic alloyed catalyst for Electroless copper deposition (ECD) were proposed by reducing the mixed metallic precursor with a simple hydrothermal method. The tunable Pd/Cu ratio plays key role of the morphologies and the electro-catalytic...
In this article, conductive nickel patterns were constructed on flexible substrates via selectively electroless deposition method, which including four procedures, namely KH550-modification, Ni2+ adsorption, selective Ni0-seeding and Ni-lines deposition. Herein, we use KH550 as a bridge for the catalyst and the surface of substrates, and Ni0 as catalyst to replace the traditional Pd catalyst. In this...
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