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Ag-alloy wire has been recognized to be a good candidate for interconnect in light-emitting diode (LED) technology. This study employed fine Ag-alloy wires bonded on Al-Si pad to investigate their failure mechanism under current stressing of 8×104A/cm2 at ambient temperature of 150°C and 175°C, respectively. We report a novel polarity effect that the spontaneous whisker growth of Ag near bonded area...
Gold wire bonding has been widely utilized in semiconductor packaging industry for electrical connections. However, since the gold price is soaring in past ten years, the alternative materials, such as copper and silver, are the candidates to replace gold. The silver alloy wire has shown many advantages, including excellent electrical and thermal properties. However, not many studies have reported...
As high-speed, high-density, and high-performance are the primary IC development targets, packaging technologies play a key role to bring out the best performance of those ICs. In this paper, an active component formed by an active chip embedded technology is developed for the package of a high speed DDR2 memory device. Embedding of semiconductor chips into an organic substrate provide a solution...
For the demand of multi-function and higher performance in electronic devices, the three-dimensional chip stacking technology with fine pitch and high input/output (I/O) interconnections has emerged recently. In addition, with the joint size becoming smaller, the current that each solder bump carried continues to increase, resulting in high current flowing in each individual joint. Therefore, electromigration...
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