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We were successful in growing a dense Cu film on Al2O3 substrates at room temperature using an aerosol deposition (AD) method. The characteristics of Cu films were investigated through electrical resistivity and X-ray photoelectron spectroscopy (XPS). The resistivity of Cu films was low (9.2–12.5 μΩ cm), but it was five to seven times higher than that of bulk copper. The deterioration of the resistivity...
Two types of ceramic-polymer composite thick films were deposited on Cu substrates by an aerosol deposition process, and their properties were investigated to fabricate optimized ceramic-based polymer composite thick films for application onto integrated substrates with the advantage of plasticity. When polymers with different mechanical properties, such as polyimide (PI) and poly(methyl methacrylate)...
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