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TSVs can be fabricated with pitch of only tens of μm, and smaller. They can be densely distributed as inter-die interconnect in 3D ICs. However, the huge mismatch between the probe technology, such as the pitch of probe head and the capacity of probe card, and the TSV fabrication technology leads to an insufficient probe on TSV tips. In this paper, we present a novel TSV probing technique that can...
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