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We have fabricated a combinatorial nm-planar electrode array by using photolithography and chemical mechanical polishing processes for high throughput electrical evaluation of organic devices. Sub-nm precision was achieved with respect to the average level difference between each pair of electrodes and a dielectric layer. The insulating property between the electrodes is high enough to measure I–V...
To reduce the effective k-value to less than 2.7 for the 45-nm node, direct CMP of a porous SiOC film (k = 2.3-2.6) without a protective cap layer was applied to Cu damascene fabrication by using a damage-less sacrificial film process. The key is controlling the molecular size of surfactants in the CMP slurries or cleaning chemicals, which are related to the moisture uptake and watermark generation...
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