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This paper analyzes the effect of driver size and number of shells on propagation delay for Multi-Walled Carbon Nanotubes (MWCNT) interconnect at 22nm technology node. An equivalent circuit model of MWCNT is used for estimation and analysis of propagation delay. The delay through MWCNT and Cu interconnects are compared for various driver sizes and number of MWCNT shells. The SPICE simulation results...
An analysis of the influence of tube diameter on single-walled nanotube (SWCNT) bundle interconnect delay is presented. The analysis shows that due to low resistance and inductance SWCNT-bundle interconnect is of lower delay than copper interconnect. Delay increases with increase in tube diameter of SWCNT. It is desirable to restrict tube diameter to the minimum possible.
This paper addresses power dissipation in single walled carbon nanotube bundle interconnect for VLSI applications at 22 nm technology node. SPICE simulation shows that due to high capacitance, SWCNT-bundle interconnect is of higher power dissipation than copper interconnect. Power dissipation decreases with increase in tube diameter of the constituent SWCNTs. CNT interconnect resistance and inductance...
This paper deals in crosstalk analysis of a CMOS-gate-driven capacitively and inductively coupled interconnect. Alpha power-law model of a MOS transistor is used to represent a CMOS driver. This is combined with a transmission-line-based coupled-interconnect model to develop a composite driver-interconnect-load model for analytical purposes. On this basis, a transient analysis of crosstalk noise is...
This paper deals in waveform analysis, crosstalk peak and delay estimation of a CMOS gate driven capacitively and inductively coupled interconnect for simultaneously switching inputs. A transmission line based coupled model of interconnect is used for analysis. Peaks and delays at far-end of victim line are estimated for the conditions when the inputs to two coupled interconnects are switching in-phase...
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