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Properties of body-centered tetragonal beta-Sn are highly anisotropic. The crystal orientation of the beta-Sn has a marked effect on the stress state in the SnAgCu solder joints. A finite element analysis has been performed of the thermal cycling of the SnAgCu solder and solder joints. Significant amounts of stresses at the solder/Cu interface and in the plane of the grain boundary was found. The...
As-reflowed Sn-Ag-Cu solder joints in various diameters were found to contain only several beta-Sn crystal grains. With the solder joints increasingly miniaturized, there is no obvious change in the grain number in a solder joint. The aged Sn-Ag-Cu solder joints are composed of very limited number of beta-Sn crystal grains as well. It appears that the solder joint size and thermal aging have less...
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