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Silicon anodes, with an extreme high theoretical specific capacity of 4200mAh g−1 and proper stable plateau potential of 0.4V, are considered one of the most promising anode materials in rechargeable Lithium-ion batteries. However, the great structural and volumetric changes during charge/discharge cycles relating to poor cycling performance are still the most critical challenges limiting the breakthrough...
According to Babinet's principle a square complementary asymmetric split ring resonator (caSRR) is proposed. Interestingly, due to the particularity of the caSRR structure, it can be fabricated on a mental sheet without the substrate, which is named as Stereo-caSRR. A microwave sensor which consists of a rectangular waveguide loaded with the square stereo-caSRR is designed. Simulation results show...
The copper substrates with different preferred orientations (200) and (220) were prepared and the interfacial reactions of the Cu(200)/Sn and Cu(220)/Sn diffusion couples were studied after annealing at 423K. The thickness and morphology of the intermetallic compounds were investigated. The appearance of the Cu3Sn was observed at Cu(220)/Sn interface after aged for 4 hours and then the thickness of...
A simple electroless deposition method of fabricating silver nanosheets which is a promising replacement for a high-temperature lead-rich solder used for electronics has been reported. This substrate free deposition method can solve the surface coating problem of the nanostructured silver. By controlling the deposition time, the silver nanosheets with a length of 2μm and a width ranging from 10nm...
A simple electroless deposition method of fabricating silver nanosheets which is a promising replacement for a high-temperature lead-rich solder used for electronics has been reported. This substrate free deposition method can solve the surface coating problem of the nanostructured silver. By controlling the deposition time, the silver nanosheets with a length of 2μm and a width ranging from 10nm...
The copper substrates with different preferred orientations (200) and (220) were prepared and the interfacial reactions of the Cu(200)/Sn and Cu(220)/Sn diffusion couples were studied after annealing at 423K. The thickness and morphology of the intermetallic compounds were investigated. The appearance of the Cu3Sn was observed at Cu(220)/Sn interface after aged for 4 hours and then the thickness of...
In this paper, the formation and growth of intermetallic compounds (IMCs) of Sn-8Zn-3Bi-0.3Cr solder on Cu, Ni and Ni-W substrates have been investigated. For the Cu substrate, only Cu5Zn8 intermetallic compound was observed. For the Ni substrate, a Ni5Zn21 film formed at the interface due to the fast reaction between Ni and Zn. For the Ni-W substrate, a thin Ni5Zn21 film appeared between the solder...
Copper nanowire is a promising material in the electronic packaging industry. However, at present, most of the preparation methods of Cu nanowires growing on substrates are highly dependent on templates or need relatively high temperature. In this study, Cu nanowires growing on substrates are synthesized by both pulse current electrodeposition and electroless plating, which is both template-free and...
Microstructure evolutions of as-reflowed and aged electroplated Cu/Sn/Cu sandwich structure with 20 or 40μm Sn layer have been investigated. Cu3Sn was observed at lower side of Cu/Sn/Cu structure with 40μm Sn layer after isothermal aging treatment for 24 hours, as for that structure with 20μm Sn layer, Cu3Sn appeared after aging for 48 hours. Regardless of Sn volume, the thickness of the blanket Cu...
Moisture ingression in plastic packages generally occurs through delaminated interfaces between different materials. So the adhesion strength between molding compound and substrate is crucial to the plastic package reliability. In the present work, a sample preparation device was designed for molding compound adhesion test. A series of experiments has been done with this device. The results showed...
Copper electrodeposited on nickel and copper alloys substrates is easy to be oxidized, and the adhesion between the oxides and substrates can be so poor that delamination happens at these interfaces, which may lead to an overall failure to the electronic device. In this work, three different substrates were prepared by applying direct current; of all these substrates the amorphous nickel-phosphorous...
The interfacial reaction between OSP, electrolytic Ni/Au, and electroless Ni/Pd/Au surface finish and SnAgCu solder on BGA package were investigated. After multiple reflows, IMC morphology and composition is examined by SEM and EDX. Cu6Sn5 formed between LF35 and OSP finish, and Ag3Sn were found disperse in the solder. Both (Nix,Cu1-x)3Sn4 and (Cux,Ni1-x)6Sn5 were observed on interface of electrolytic...
The effect of crystal orientation on the oxidation failure of pure copper was investigated. XRD results indicated that the oxide film grown on copper surface was mainly composed of Cu2O. The adhesion strength between Cu(110) and its oxidization film was the highest, whereas, the adhesion strength between Cu (311) and its oxidization film was the lowest. SEM observations revealed that the oxide film...
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