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Tiny defects were observed by SEM (scanning electron microscopy) on pad surface. In order to identify the root cause, TEM (transmission electron microscopy) and EDX (energy dispersive X-ray) techniques were used to do failure analysis. The SEM images showed that the tiny surface defects were pits. Higher Cu concentration at pits area was detected compared with normal area based on the EDX data. TEM...
The interfacial reaction between OSP, electrolytic Ni/Au, and electroless Ni/Pd/Au surface finish and SnAgCu solder on BGA package were investigated. After multiple reflows, IMC morphology and composition is examined by SEM and EDX. Cu6Sn5 formed between LF35 and OSP finish, and Ag3Sn were found disperse in the solder. Both (Nix,Cu1-x)3Sn4 and (Cux,Ni1-x)6Sn5 were observed on interface of electrolytic...
20 meters long length of in-situ SiC doped MgB2/Fe, MgB2/Nb/Cu/stainless steel (SS) mono- or MgB2/Nb/Cu/Fe multi- filamentary wires with high critical current densities have been prepared by combining both powder in tube (PIT) and continuous tube forming & filling (CTFF) processes. Particular efforts were made in view of the optimization of the manufacturing and annealing processes of the wires...
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