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Electromagnetic noise caused by high speed digital and radio frequency electronic devices can affect the normal operation of other devices within the same system and result in significant intra-system electromagnetic interference (EMI) problems. Conformal shielding is an emerging method to prevent EMI by using metallization techniques to coat a thin metal layer around the package. In this study, copper...
Electromagnetic noise caused by high speed digital and radio frequency electronic devices can affect the normal operation of other devices within the same system and result in significant intra-system electromagnetic interference (EMI) problems. Conformal shielding is an emerging method to prevent EMI by using metallization techniques to coat a thin metal layer around the package. In this study, copper...
Ag-8Au-3Pd alloy wire has shown its advantages as a kind of interconnect material in semiconductor packaging. In thermosonic wire bonding, a uniformed and stable Free-Air-Ball (FAB) created by electronic flame-off (EFO) is crucial to a reliable 1st bond. In this study, the relationship between Free-Air-Ball (FAB) size and EFO parameters (EFO current, EFO time) of 0.6 mil Ag-8Au-3Pd alloy wire has...
Electronic assembly technology is in the transition from traditional tin-lead to lead-free. In comparison with Sn-Pb solders, high melting point and poor wettability of the lead-free solders lead to great challenge to present electronic assembly technologies. Inert nitrogen atmosphere can both widen the process window of reflow and improve the mechanical reliability of solder joints. The focus of...
In this paper, based on the structure of lithium-ion batteries, the electrode materials were separated from spent lithium-ion batteries (LIBs) with aim to recycle all valuable components as possible. The spent LIBs were dismantled first, then the mechanical pulverization and sieving process was adopted in the separation of anodes, and dissolution method was used to partition active components from...
20 meters long length of in-situ SiC doped MgB2/Fe, MgB2/Nb/Cu/stainless steel (SS) mono- or MgB2/Nb/Cu/Fe multi- filamentary wires with high critical current densities have been prepared by combining both powder in tube (PIT) and continuous tube forming & filling (CTFF) processes. Particular efforts were made in view of the optimization of the manufacturing and annealing processes of the wires...
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