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The rapid development of three dimensional packaging makes it necessary to develop smaller and more reliable microbumps. In the electrodeposition process of bump cylinder, the filling quality is largely determined by the combination of additives. In this work, the effect and competitive adsorption between suppressor polyethylene glycol (PEG) and accelerator Bis-(3-sodiumsulfopropyl disulfide) (SPS)...
TSV (Through Silicon Via) is an enabling technology for 3D WLP (Wafer Level Packaging) and 3D integration. TSV is a very hot topic for semiconductor industry today. One of the key processes for TSV is the electroplating process. The quality and rate of electroplating are two critical parameters for TSV filling, which can be significantly improved by Bottom-Up filling with much thinner overburden....
The effect of polyethylene glycols upon copper electrodeposition in methanesulfonate electrolytes is discussed in this paper. By means of linear sweep voltammetry and electrochemical impedance spectroscopy, it is found that polyethylene glycols in methanesulfonat electrolytes have very different behavior from that in traditional sulfuric electrolytes. PEG can adsorb on electrode surface in absent...
In this paper, based on the structure of lithium-ion batteries, the electrode materials were separated from spent lithium-ion batteries (LIBs) with aim to recycle all valuable components as possible. The spent LIBs were dismantled first, then the mechanical pulverization and sieving process was adopted in the separation of anodes, and dissolution method was used to partition active components from...
Deep via filling is one of key technologies of 3D packaging. Vias are commonly filled by electroplating. Since cupric transportation in vias is limited by diffusion, Current density is one of the most influential factors for copper plating in vias. We investigated new additive of accelerator, suppressor and leveler. Simulation of the competitive adsorption ability of accelerator and suppressor at...
TiO2 nanotubes have wide applications in gas sensing applications such as oxygen sensors and hydrogen sensors. In this work, crystallized TiO2 nanotubes self-assembled on Ti substrate were fabricated through anodization and heat-treatment. The anodization parameters for fabricating optimized nanostructures were investigated and hydrogen sensing properties of the nanotubes were tested. It was found...
Copper electrodeposition in acidic cupric methanesulfonate bath with organic additives is discussed in this paper. The influence of poly(ethylene glycol) (PEG) and bis-(3-sodiumsulfopropyl disulfide) (SPS) on copper deposition were studied by means of linear sweep voltammetry, cyclic voltammetry and chronoamperometry. These electrochemical analysises revealed a competition of PEG and SPS on electrode...
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