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This work was designed for low-temperature mechanical properties of the solder joints, the temperature is 293K, 223K, 173K, and 123K, in order to get the mechanical strength and mechanism of fracture at low temperature; Cryogenic temperature (77K) storage experiment is applied to get microstructure of internal solder joint, and the evolution of IMC and other microstructures, as well as solder joints'...
This paper manages to obtain the technological parameter by studying the parallel gap resistance bonding of thick wire. Then the connection mechanism of copper and nickel wire on the tin coated copper solder is explored. Thirdly, the temperature field distribution during the process of bonding is also achieved by building the three-dimensional heat transfer model based on ANSYS software. The results...
A new approach of rapid fabrication of intermetallic compounds (IMCs) solder joints at ambient temperature was investigated in this work. The high share strength Cu/Sn/Cu solder joints were obtained by using different strong electric currents 0.8KA, 0.9KA, 1.0KA, and 1.2KA for only about 0.2s. The Sn foils with the thickness of 10μm were used as solders. The results showed that with the current intensities...
A new approach of rapid fabrication of intermetallic compounds (IMCs) solder joints at ambient temperature was investigated in this work. The high share strength Cu/Sn/Cu solder joints were obtained by using different strong electric currents 0.8KA, 0.9KA, 1.0KA, and 1.2KA for only about 0.2s. The Sn foils with the thickness of 10μm were used as solders. The results showed that with the current intensities...
This paper manages to obtain the technological parameter by studying the parallel gap resistance bonding of thick wire. Then the connection mechanism of copper and nickel wire on the tin coated copper solder is explored. Thirdly, the temperature field distribution during the process of bonding is also achieved by building the three-dimensional heat transfer model based on ANSYS software. The results...
This work was designed for low-temperature mechanical properties of the solder joints, the temperature is 293K, 223K, 173K, and 123K, in order to get the mechanical strength and mechanism of fracture at low temperature; Cryogenic temperature (77K) storage experiment is applied to get microstructure of internal solder joint, and the evolution of IMC and other microstructures, as well as solder joints'...
Growth mechanisms of Cu-Sn IMC joints bonded at 300°C on polycrystalline and single crystal Cu substrates were investigated by Scanning Electron Microscopy (SEM) and Electron Backscatter Diffraction (EBSD) technology. The results showed that the prism-type Cu6Sn5 grains formed on single crystal Cu substrate in the initial stage grew into the scallop-type Cu6Sn5 grains by grain rotation and merge mechanism...
EM degradation mechanisms were closely related to Sn-grain orientations at the interface. In multi-grain Sn0.7Cu joints, the Cu plate hollow crack at the cathode caused by the rapid dissolution of cathode IMC and Cu interstitial diffusion to anode lead to electrical failure at an early stage, when the c axis is roughly aligned with the electrical current. Single-grain structure with layered twinning...
Pure Sn, Sn-0.7Cu, Sn-1.5Cu and Sn-3.0Cu solder joints were fabricated by a laser reflow soldering method, and then they were aged at 125degC for various periods. After 600 hours treatment, we found that thickness of Intermetallic Compounds (IMCs) in the pure Sn solder joints was 54mum. However, in the solder joints with Cu addition, formation of AuSn4 IMCs was inhibited, and other two kinds of Sn-Cu-Au...
Properties of body-centered tetragonal beta-Sn are highly anisotropic. The crystal orientation of the beta-Sn has a marked effect on the stress state in the SnAgCu solder joints. A finite element analysis has been performed of the thermal cycling of the SnAgCu solder and solder joints. Significant amounts of stresses at the solder/Cu interface and in the plane of the grain boundary was found. The...
As-reflowed Sn-Ag-Cu solder joints in various diameters were found to contain only several beta-Sn crystal grains. With the solder joints increasingly miniaturized, there is no obvious change in the grain number in a solder joint. The aged Sn-Ag-Cu solder joints are composed of very limited number of beta-Sn crystal grains as well. It appears that the solder joint size and thermal aging have less...
To meet the urgent demands of future electronic packages, the solder joints have to become increasingly miniaturized. Compared to the large solder joints, mechanics behavior for the samll solder joints is very different, resulting in a series of reliability issues. Therefore, it is very important to understand the mechanics behavior of the small solder joints. In this paper, the shear test of the...
Independent elastic constants of single-crystal Au5Sn and AuSn were determined through first-principles calculations to characterize their elastic anisotropy. The ideal elastic moduli and Poissonpsilas ratio of Au5Sn were determined using the Voigt-Reuss-Hill method and were very close to the range of experimental results; but the ideal Youngpsilas modulus of AuSn was much smaller than the experimentally...
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