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Formation of AuSnx IMCs in laser reflowed solder joints protected by N2 atmosphere at room temperature, 60°C, 100°C and 130°C was investigated respectively. The solder balls were Sn-2.0Ag-0.75Cu-3.0Bi, and 120μm in diameter. The surface finish of one pad in the solder joints was 4.0μmAu/0.1μmNiFe/0.01μmTa, the other pad was made of Cu plated with 3.0μm thickness of Au. The laser reflow time was within...
Pure Sn, Sn-0.7Cu, Sn-1.5Cu and Sn-3.0Cu solder joints were fabricated by a laser reflow soldering method, and then they were aged at 125degC for various periods. After 600 hours treatment, we found that thickness of Intermetallic Compounds (IMCs) in the pure Sn solder joints was 54mum. However, in the solder joints with Cu addition, formation of AuSn4 IMCs was inhibited, and other two kinds of Sn-Cu-Au...
Au surface finish is very common used as a protection layer on pad. In the traditional reflow process, Au is dissolved into solder, and AuSn4 intermetallic components (IMCs) forms. However, for the solder joints fabricated by laser soldering, the morphology and distribution of the AuSnx IMC are quite different from that in solder joints fabricated by traditional reflow methods. This paper reports...
The interfacial reaction between Sn-Ag-Cu and Sn-Ag lead-free solder balls and Au/Ni/Cu pads in laser reflow process are presented in this paper. A continuous intermetallic compound layer and some needle-like AuSn4 were observed at the interface of solder and pad, their morphology and distribution were strongly dependent on the laser input energy. Some voids were observed at the interface of solder...
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