The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Hydrophilic bonding is commonly used in the wafer bonding field. Water management is of great importance to obtain good bonding quality over the entire bonded pairs. However, current wafer bonding equipments do not have the function of regulating the surface humidity prior to bonding. It is difficult to make a quantitative study on the role of moistures in the bonding process. In this paper, a novel...
Because of the complicated configuration in MEMS devices, significant technical challenges are presented for the interconnection of dissimilar materials. Since tin soldering is an effective method for joining dissimilar materials, there are still some reliability problems in later service process, such as remelting of Sn solder, excessive microstructure evolution. In the present work, a parallel gap...
Self-supporting Ti/Al (1:1 atomic ratio) multilayer films with different modulation structures were prepared using magnetron sputtering method and a sacrificial layer process. These films were ignited by single pulse irradiation for their self-propagating reactions. The ignition fluence thresholds were determined and their microstructures were observed using scanning and transmission electron microscope...
Self-supporting Ti/Al (1:1 atomic ratio) multilayer films with different modulation structures were prepared using magnetron sputtering method and a sacrificial layer process. These films were ignited by single pulse irradiation for their self-propagating reactions. The ignition fluence thresholds were determined and their microstructures were observed using scanning and transmission electron microscope...
Compared with integrated circuits, MEMS devices are more sophisticated and diverse. The complex non-planar micro components of MEMS devices raise the urgent needs for three-dimensional (3-D) packaging. To fulfill the specific needs in 3-D MEMS packaging, the basic concepts of a new 3-D integrated solder ball bumping & bonding method for MEMS devices was proposed. A prototype platform was developed...
With the development of optoelectronics and microelectromechanical systems (MEMS) packaging, laser soldering has become an extensively used interconnection technique in electronic manufacturing industry. Postsolder shift in assembling of such components is the most challenging issue to affect the packaging yields. To maintain a high coupling efficiency or accuracy, tight control of postsolder shift...
A VOF model is developed to simulate the solder spreading and solidification during solder jet bumping process. This model is based on fixed mesh method, and accounts for the surface tension, wetting effects, and heat transfer with solidification. The visualizations of the transient impact processes are employed in order to compare and validate the numerical model presented. Results show the spreading...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.