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A new approach of rapid fabrication of intermetallic compounds (IMCs) solder joints at ambient temperature was investigated in this work. The high share strength Cu/Sn/Cu solder joints were obtained by using different strong electric currents 0.8KA, 0.9KA, 1.0KA, and 1.2KA for only about 0.2s. The Sn foils with the thickness of 10μm were used as solders. The results showed that with the current intensities...
A new approach of rapid fabrication of intermetallic compounds (IMCs) solder joints at ambient temperature was investigated in this work. The high share strength Cu/Sn/Cu solder joints were obtained by using different strong electric currents 0.8KA, 0.9KA, 1.0KA, and 1.2KA for only about 0.2s. The Sn foils with the thickness of 10μm were used as solders. The results showed that with the current intensities...
Growth mechanisms of Cu-Sn IMC joints bonded at 300°C on polycrystalline and single crystal Cu substrates were investigated by Scanning Electron Microscopy (SEM) and Electron Backscatter Diffraction (EBSD) technology. The results showed that the prism-type Cu6Sn5 grains formed on single crystal Cu substrate in the initial stage grew into the scallop-type Cu6Sn5 grains by grain rotation and merge mechanism...
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