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A 3-D numerical model has been developed to investigate the transient thermal, electrical, and optical output performance of a single-chip light-emitting diode (LED) with an interdigitated mesa geometry under dc operation and a multimicrochip LED under either dc or full-wave operation. These two LED chips are fabricated on the same sapphire wafer. The junction temperature, the light output power,...
In this paper we report the development of a new roller imprinting method which is capable of transferring patterns with line-width down to few hundreds nm from a silicon mold to a substrate based on focused infrared heating. This new technique significantly increases the size of imprinting area as well as the imprinting speed as compared to conventional IR- Laser Assisted Imprinting (IR-LAI) method,...
This paper reports a novel contact printing method which can transfer patterned metallic films directly from a mold to a substrate, based on applied contact pressure and infrared pulse laser heating. Experiments have been carried out using a 1064 nm pulsed Nd:YAG laser to demonstrate the feasibility of the proposed method. Chromium (Cr) films of 70 nm thickness with both array-dot patterns and linear...
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