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Wafer cleanliness and surface roughness play a paramount role in an anodic bonding process. Impurities and the roughness on the wafer surface result in unbonded areas which lead to fringes and Newton׳s rings. With an augment in surface roughness, lesser area will be in stroke thus making more pressure and voltage to be applied onto the wafers for better bonding. Eventually it became mandatory to choose...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.