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The rapid solidification of Al-30%Cu-18%Ag ternary alloy is investigated by using the free fall method. Its solidified microstructure is composed of θ(Al2Cu), α(Al) and ξ(Ag2Al) phases. The liquidus temperature and solidus temperature are determined as 778 and 827 K, respectively. The alloy melt undercooled amounts up to ΔTMax=171 K (0.20TL). Its microstructural evolution is investigated based on...
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