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A fluxless flip-chip bonding process in hydrogen environment using newly developed Sn-rich Sn-Au electroplated multilayer solder bumps is presented. Cr/Au dual layer is employed as the plating seed layer and the underbump metallurgy (UBM). This UBM design, seldom used in the electronic industry, is explained in some details. To realize the fluxless possibility, proper intermetallic growth over the...
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