Search results for: Hui-Wang Cui
Advances in Polymer Technology > 36 > 2 > 211 - 219
Wood Science and Technology > 2016 > 50 > 2 > 285-296
Electronic Materials Letters > 2015 > 11 > 2 > 315-322
Nano Research > 2015 > 8 > 5 > 1604-1614
Journal of Thermal Analysis and Calorimetry > 2015 > 122 > 1 > 295-305
Journal of Thermal Analysis and Calorimetry > 2015 > 119 > 1 > 425-433
Applied Clay Science > 2014 > 101 > C > 604-607
Applied Clay Science > 2014 > 91-92 > Complete > 1-5
International Journal of Adhesion and Adhesives > 2014 > 49 > Complete > 33-37
Electronic Materials Letters > 2014 > 10 > 1 > 183-189
Wood Science and Technology > 2014 > 48 > 6 > 1123-1137
Korea-Australia Rheology Journal > 2014 > 26 > 2 > 185-189
Journal of Thermal Analysis and Calorimetry > 2014 > 117 > 3 > 1365-1373
Polymer Bulletin > 2014 > 71 > 3 > 659-672
European Polymer Journal > 2014 > 50 > Complete > 168-176
International Journal of Adhesion and Adhesives > 2014 > 48 > C > 177-182
Advances in Polymer Technology > 33 > 1 > n/a - n/a
Polymer International > 62 > 11 > 1644 - 1651
International Journal of Adhesion and Adhesives > 2013 > 44 > Complete > 232-236
International Journal of Adhesion and Adhesives > 2013 > 44 > Complete > 220-225