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We analyzed and compared the optical, spectral, and thermal characteristics of InGaN/GaN near‐ultraviolet (NUV) flip‐chip (FC) light‐emitting diodes (LEDs) packaged on the board with dielectric/metal layers (DMB package), board with ceramic/metal layers (CMB package), and board with ceramic/metal layers and thermal tape (CMBT package) in the injection current range of 0–800 mA at 298 and 358 K. For...
The temperature‐dependent device characteristics of InGaN/GaN near‐ultraviolet light‐emitting diodes, operating at λ ∼380 nm, with a chip size of 0.5 × 1 mm2 were reported. Their optical and spectral properties were measured and analyzed at different injection current levels and heatsink temperatures. The device performance showed the optical output power of 92.8 mW, forward voltage of 4.30 V, and...
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