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In recent years, the IoT popularity pushes the package development of 3C products into a more functional and thinner target. For high I/O density and low cost considered package, the promising Fan-out Wafer Level Packaging (FOWLP) provides a solution to match OSAT existing capability, besides, the chip last process in FOWLP can further enhance the total yield by selectable known-good dies (KGDs)....
Large 2.5D IC leads the trend for Field Programmable Gate Array (FPGA), graphic, and network application. Chip module (CM) is comprised of top die and Si interposer, and underfill (UF) is fully filled between them. However, coefficient of thermal expansion (CTE) of UF is greater than 20ppm, and CTE mismatch occurs between UF and Si (CTE~3ppm). How to tune chip module warpage is a key for large 2.5D...
The original purpose of the Re-Distribution Layers(RDL) was to assist in the adaption of metal bumping and flipchip packaging technologies, by the addition of the metal anddielectric layers onto the wafer surface to re-route the legacydesigned irregular peripheral I/O layout, into a new area arraybond pads layout to facilitate a balanced metal bumps and flipchip bonding. The redistribution layer technology...
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