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Chip-scale package (CSP) light-emitting diodes (LEDs) are considered as the next generation of highly efficient package LED. However, they suffer from total internal reflection that limits their light extraction efficiency (LEE). In this letter, surface patterning, in terms of microstructures, as a well-controlled surface roughness method is designed and applied on CSP-LED to improve the LEE. Based...
Surface patterning, in terms of microstructure, as a precise surface roughness method for chip scale package (CSP) LED, will enormously improve the light extraction efficiency (LEE) with much less total internal reflection loss. In this paper, several kinds of microstructures and layouts have been designed and optimized by using the Monte Carlo ray-tracing simulation method. During the simulation,...
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