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Stresses due to thermal mismatch develop in thin coatings ZrN deposited by arc ion plating technique when cooled down to room temperature from deposition temperature. A 2D finite element model for coating substrate system has been investigated to simulate thermal mismatch stress. It has been validated that mismatch of coefficient of thermal expansion (CTE) and Young's modulus is significant to thermal...
A thorough understanding of the mechanics of lead-free solder joint in a ball grid array (BGA) assembly under expected operating conditions is essential in developing reliable life prediction models. In this respect, accurate deformation response of Sn-4Ag-0.5Cu (SAC405) solder under varying temperature cycles and straining rates is established using unified inelastic strain theory. The mechanics...
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