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In this paper, a user behavior based solder joint reliability modeling approach has been proposed to estimate the design and test requirements for the second level interconnect (SLI) reliability prediction. This approach uses a numerical tool to integrate solder joint creep damage during the actual use condition that was collected from a large user sample size. The resultant damage per time period...
The changeover from eutectic Sn-Pb solders to lead-free solders has been driven by environmental concerns and market accessibility in the last few years. Though a number of creep constitutive laws of lead-free solder have been reported due to the importance of creep in solder joint failure in the electronic packaging, these constitutive laws often show great variations across the applicable stress...
Solder delamination is one of the main failure modes of IGBT module. When the severity of the failure mode is different, the temperature character of IGBT is also different. This paper presents a methodology based on 3D thermal-electro coupling finite elements modeling intended to analyze the relation between the failure degree and the temperature, The results suggest when the area of solder delamination...
This paper proposes a new prediction method for electromigration (EM) induced void generation of solder bumps in a wafer level chip scale package. The methodology is developed based on discretized weighted residual method in a user-defined finite element analysis framework to solve the local ME governing equation with the variable of atomic concentration. The local solution of atomic concentration...
In this paper we discuss the lifetime prediction for Pb-free soldered flip chip components under combined temperature cycling (TC) and vibration loading in terms of the failure mechanisms related to solder joint fatigue. We show the results of several experiments including failure analysis and comparison of lifetime models. For this purpose finite element analyses (FEA) of the thermal cycling and...
With the current trend of less expensive, faster, and better electronic products, it has become increasingly important to evaluate the IC package and system performance early in the design stage using simulation tools. For the solder joint subjected to cyclic stresses generated during the thermal cycling, its reliability depends on its resistance to creep and fatigue. The approach for simulation in...
CBGA (ceramic ball grid array) is one kind of advanced package for FPGA, which can fulfill the demands of high interconnect density, high thermal and electronic performance, high chip-assembling yields, high reliability. But in multiple loading environments, CBGA has the invalidation mode of solder joint thermal-mechanical failure, which will influence the long term reliability of FPGA circuits. But...
This paper uses a statistical approach to simulate the yield loss due to HIP (head-in-pillow) based on experimental work including production data. Detailed analyses on the HIP formation and mechanism were performed using Surface Evolver and optical measurement. Stackup analysis using statistical modeling and Monte Carlo simulation is performed to assess the magnitude of yield loss. From this study,...
This paper described a ceramic ball grid array (CBGA) and its second level reliability. The CBGA uses a substrate with high coefficient of thermal expansion (CTE) and leadfree soldering. The reworkability of the BGA package and board was also studied. The results have shown that this package is reworkable without a significant reliability reduction in the board level reliability. The reliability of...
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