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This paper described the shadow moire measurement of bare flip chip coreless and standard (3/2/3) BGA substrate to inspect the change of each thermal history (0hr, after pre-baking, fR-reflow), the warpage increased significantly on IR reflow peak temperature and largest warpage located around the C4 area of coreless FCBGA substrate and standard FCBGA substrate change was not obvious. Electrical performance...
Underfilling with capillary liquid encapsulants is a common process for the majority of flip-chip packages. A secondary process with plastic encapsulation using a molding compound may follow, serving to protect the die from mechanical damage. Due to the need to cost savings, recent developments of suitably engineered epoxy molding compounds have made a single step transfer underfilling/overmolding...
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