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Transient analysis of large-scale power delivery network (PDN) is a critical task to ensure the functional correctness and desired performance of today’s integrated circuits (ICs), especially if significant transient noises are induced by clock and/or power gating due to the utilization of extensive power management. In this paper, we propose an efficient algorithm for PDN transient analysis based...
Through-silicon via (TSV) could provide vertical connections between different dies in three-dimensional integrated circuits (3D ICs), but the significant silicon area occupied by TSVs may bring great challenge to designers in 3D clock tree synthesis (CTS) because only few whitespace blocks can be used for clock TSVs after floorplan and placement. Unlike most of the published previous works that ignore...
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