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Nanotwinned copper has been got widely attention in microelectronics because it simultaneously demonstrate high strength, high conductivity, superior thermal stability, which makes it a very promising candidate to replace the position of common copper in the next generation of IC and packaging materials. The redistribution layer, a key process of wafer level packaging, was tailored by pulse electrodeposited...
Nanotwinned copper has been got widely attention in microelectronics because it simultaneously demonstrate high strength, high conductivity, superior thermal stability, which makes it a very promising candidate to replace the position of common copper in the next generation of IC and packaging materials. The redistribution layer, a key process of wafer level packaging, was tailored by pulse electrodeposited...
Warpage is one of the challenging problems for wafer level package (WLP). Especially, the bonding process of multiple wafers will bring additional stress to WLP and warpage of WLP. This paper aims at the stress and warpage characteristics of the WLP (consisting of silicon cover wafer and silicon MEMS wafer) with glass frit bonding. The finite element (FE) method and MOS (Multi-beam Optical Sensor)...
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