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Fan-out wafer level packaging (FO-WLP) technology has been developed to shrink package size, to accommodate increasing I/O densities and to provide better electrical performance. However, wafer warpage induced during the process poses a threat to the yielding and reliability. In this paper, the warpage evolution during the FO-WLP process was investigated by theoretical calculation and finite element...
The wafer warpage problem, mainly originated from coefficient of thermal expansion mismatch between the materials, becomes serious in wafer level packaging as large diameter wafer is adopted currently. The warpage poses threats to wafer handling, process qualities, and can also lead to serious reliability problems. In this paper, a novel mechanical diced trench structure was proposed to reduce the...
Wafer warpage in wafer level packaging process poses threats to wafer handling, process qualities, and can also lead to unacceptable reliability problems. With larger diameter wafer adopted, this issue becomes more serious. In the paper, a new designed trench structure was introduced in WLP process to reduce the final wafer warpage. Both experiment and simulation methods are used to investigated the...
Nanotwinned copper has been got widely attention in microelectronics because it simultaneously demonstrate high strength, high conductivity, superior thermal stability, which makes it a very promising candidate to replace the position of common copper in the next generation of IC and packaging materials. The redistribution layer, a key process of wafer level packaging, was tailored by pulse electrodeposited...
Nanotwinned copper has been got widely attention in microelectronics because it simultaneously demonstrate high strength, high conductivity, superior thermal stability, which makes it a very promising candidate to replace the position of common copper in the next generation of IC and packaging materials. The redistribution layer, a key process of wafer level packaging, was tailored by pulse electrodeposited...
Wafer warpage in wafer level packaging process poses threats to wafer handling, process qualities, and can also lead to unacceptable reliability problems. With larger diameter wafer adopted, this issue becomes more serious. In the paper, a new designed trench structure was introduced in WLP process to reduce the final wafer warpage. Both experiment and simulation methods are used to investigated the...
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