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For a nanoscale low-k dielectric wafer, Inter-Layer Dielectric and metal layers peelings, cracks, chipping, and delamination are the most common dicing defects by traditional blade sawing process. This paper demonstrates an investigation on uv laser grooving on low-k dielectric 65-, 45-, and 28-nm wafers. A series of parametric study on input laser power, frequency, grooving feed speed, defocus amount...
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