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This study aims to investigate the interfacial reaction and the impact reliability of Sn–3.0Ag–0.5Cu/Cu–15Zn (wt.%; SAC/Cu–Zn) solder joints. The Cu–Zn under bump metallization (UBM) was developed to replace the traditional Cu UBM in the Pb-free solder joints. In the Sn–Ag–Cu/Cu solder joint, thick Cu6Sn5 and Cu3Sn intermetallic compounds (IMCs) formed at the interface after thermal aging at 150°C...
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