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The interfacial reactions in Sn, Sn-3.0Ag-0.5Cu (SAC, in wt%) and Sn-9Zn (SZ, in wt%) lead-free solders reacting with the Cu-40Zn alloys were investigated. The results were indicated that the (Cu, Zn)6Sn, and (Cu, Sn)Zn phases were formed in the Sn/Cu-40Zn couple reacted at 240 and 270 °C. When the reaction temperature was increased to 300 °C, the (Cu, Sn)Zn with the layered structure and metastable...
The electromigration (EM) effect has been known to be atomic diffusion due to unbalanced electrostatic and electron-wind forces exerted on metal ions. Recent theoretical model on the mechanism were focused on the kinetics point of view. However, none of these models has coupled the EM effect and lattice stability. In this work, in situ current stressing experiments using synchrotron X-ray diffractometry...
In this paper, a 3D chip-to-chip hetero-integration scheme without Si interposer is demonstrated under 270°C thermal budget. The scheme successfully integrates advanced and common technology node logic chips by Cu/Sn to ENIG bumping. Cu/Sn μ-bumps are electroplated on common technology node and ENIG joints are electroless-plated on advanced technology node opening pads, respectively. Herein, 60 μm...
Micro-electro-mechanical systems (MEMS) and Nano-electro-mechanical systems (NEMS) are emerging technologies that uses tools and techniques in the microelectronics industry to build microscopic machines. Electrostatic force is often employed to drive the motion components in MEMS and NEMS devices, which could cause extremely high electric field (more than 108 V/m) between two metal conductors. However,...
The aim of this study was to describe a chemical modification on fast-growing woods. After modification, it was found that the bending strength increased 42.7%, the compressive strength parallel to grain increased 37.8%. Moreover, the characteristics of the unmodified and modified samples were studied by X-Ray Diffraction (XRD), Fourier transform infrared spectroscopy (FTIR), and Scanning Electron...
SnCu2-4Ni1-2 as a lead-free solder was prepared from both sulfate and chloride plating solutions by galvanostatic electrodeposition. Current-potential polarizations for both plating baths were obtained with their respective deposition rates measured. Characterizations including SEM, EDX, and XRD were carried out to obtain relevant materials properties.
A Cu/Ni UBM and Sn-2.5Ag lead-free solder for 20 μm pitch micro-bump was successfully fabricated via consecutive electroplatings of Cu, Ni, and binary SnAg. Materials characterizations such as Scanning Electron Microscopy (SEM), X-ray Diffraction (XRD), Electron Probe Micro-analyzer (EPMA), and X-ay Photoelectron Spectroscopy (XPS) were carried out to obtain relevant materials properties. We observed...
Hollow mesoporous silica nanospheres with large pores have been synthesized by a newly developed green approach, and the highly dispersed hydrophobic magnetite nanoparticles were then loaded into hollow nanospheres through the large pores with a vacuum impregnation technique. The obtained Fe3O4-hollow mesoporous silica composites exhibit superparamagnetic property and ultra-fast immobilization speed...
RuO2 nanocrystals (NCs) were deposited on carbon nanotubes (CNTs) by reactive RF magnetron sputtering using a Ru target under different conditions. Their surface morphology, structural, spectroscopic and field emission (FE) properties were studied using field emission scanning electron microscopy (FESEM) and transmission electron microscopy (TEM), Raman spectroscopy, and a home made high vacuum FE...
This paper reports the photoelectric property and surface morphology of amorphous titanium dioxide (TiO2) made at the different substrate temperatures by RF- sputtering on the glass. Five different temperatures (room temperature, 100degC, 200degC, 300degC and 400degC) are set on the substrate holder. The thicknesses of the film are 100 nm, 300 nm and 500 nm. After preparing amorphous TiO2 thin film,...
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