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With the population of portable device growing, mechanical drop reliability of BGA soldering becomes more and more important. Drop test for the BGA-PCB assemblies can be performed in both horizontal and vertical directions. Unfortunately, soldering in vertical drop test will generally fail only under such an ultrahigh acceleration that is too high to be achieved by the conventional drop tester. So...
As environment pollution and health problem became more and more seriously concerned, the electronic packaging industry is facing the challenge of changeover to "green", using the lead-free solder alloy is the trend instead of the traditional 63Sn/37Pb solder. In this paper, a PCB-level drop test for BGA package will be introduced and the mechanism of the solder joint mechanical fatigue...
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