The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Reliable, consistent, and comprehensive material property data are needed for microelectronics encapsulants for the purpose of mechanical design, reliability assessment, and process optimization of electronic packages. Since the vast majority of contemporary underfills are epoxy based, they have the propensity to absorb moisture, which can lead to undesirable changes in their mechanical and adhesion...
In this work, the viscoelastic mechanical response of a typical underfill encapsulant has been characterized via rate dependent stress-strain testing over a wide temperature range, and via creep testing for a large range of applied stress levels and temperatures. The 60 × 3 × 0.5 mm test specimens were dispensed and cured with production equipment using the same conditions as those used in actual...
Microelectronic encapsulants exhibit evolving properties that change significantly with environmental exposures such as isothermal aging and thermal cycling. Such aging effects are exacerbated at higher temperatures typical of thermal cycling qualification tests for harsh environment electronic packaging. In this work, the material behavior changes occurring in flip chip underfill encapsulants (silica...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.