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The objective of this study is to propose an in-situ measurement of the warpage of the PCB during reflow process (or SMT process) using strain gauges. In the experiments, a full-field shadow moiré is used for measuring the out-of-plane deformations (or warpage) of a bi-material plate and the PCB with DIMM sockets during solder reflow heating. A finite element method (FEM) is used to analyze the thermally-induced...
Trends in the packaging of semiconductors are towards miniaturization and high functionality. The package-on-package (PoP) with increasing demands is beneficial in cost and space saving. This study conducts the assembly of the PoP component through the stacking process. Samples are subject to thermal cycling test condition, 0°C to 100°C. The failure of samples is defined as when the measured resistance...
The purpose of this study is to in-situ measure the warpage of the PCB with surface-mount dual in-line memory module (DIMM) sockets during reflow process by using strain gages. In the experiments, a full-field shadow moire is used for measuring real-time out-of-plane deformations (or warpage) of the PCB with DIMM sockets under heating condition. A finite element method (FEM) is used to analyze the...
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