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Cutter runout due to cutter axis offset is quite common in a milling process, yet it is difficult to directly measure the runout geometry of a ball end cutter during the cutting process. This paper presents an analytical method for the estimation of cutter radial offset via forces in ball end milling. Closed form expression for the total milling force in the presence of cutter offset is first obtained...
Flip chip on board (FCOB) technology involves the bonding of a bare die directly onto a printed circuit board (PCB). The interconnections are provided by solder bumps which are arranged in the area under the chip. Encapsulation is the preferred process to reduce the impact of the thermal stress that results from the mismatch in the coefficient of thermal expansion (CTE) between the silicon chip and...
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