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This study proposed a novel method for real-time detection of wafer position on a robot blade during the transfer process. The wafer positioning system comprises two line-shaped beams spreading toward a scattering surface on the way of wafer transfer. The images taken from a CCD (charge coupled device) camera mounted above the scattering surface are analyzed, and the instant position of the wafer...
A laser scanning method for wafer positioning is proposed. This wafer positioning method incorporates a laser scanner system and a scattering light receiving system. The scanner is used to reflect a laser beam into a scanning line on the sensing area. As the wafer passes by the scanning line, a scattering light receiving system detects the time-sequence signal of the scattered lights. The position...
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