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Gold wire bonding has been widely utilized in semiconductor packaging industry for electrical connections. However, since the gold price is soaring in past ten years, the alternative materials, such as copper and silver, are the candidates to replace gold. The silver alloy wire has shown many advantages, including excellent electrical and thermal properties. However, not many studies have reported...
Copper wires are increasingly used to replace gold wires in wire-bonding technology owing to their better electrical properties and lower cost. However, not many studies have been conducted on electromigration-induced failure of Cu wedge bonds on Al metallization. In this study, we investigated the failure mechanism of Cu-Al wedge bonds under high current stressing from 4 × 104 A/cm2 to 1 × 105 A/cm...
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