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The effect of microstructure and purity on the native oxidation of Cu was studied by using angle-resolved X-ray photoelectron spectroscopy (AR-XPS) and spectroscopic ellipsometry (SE). A high quality copper film prepared by ion beam deposition under a substrate bias voltage of −50V (IBD Cu film at V s =−50V) showed an oxidation resistance as high as an ultra high purity copper (UHP Cu) bulk,...
Copper-modified alumina catalysts, designed for NO removal under lean-burn engine conditions, have been investigated from the viewpoint of the structural phase transition and thermal stability. The structural changes of crystalline components heat-treated at temperatures from 500 to 1100°C were characterized by the neutron diffraction (ND) method. In the as-prepared materials, powder-diffraction patterns...
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