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In the dark silicon era, a fundamental problem is: given a real-time computation demand represented by a set of independent applications with their own power consumption, how to determine if an on-chip multiprocessor system is able to respond to this demand and maintain its reliability by keeping every core within the safe temperature range. In this paper, we first present a novel thermal model for...
The increasing power consumption of integrated circuits (ICs) enabled by technology scaling requires more efficient heat dissipation solutions to improve overall chip reliability and reduce hotspots. Thermal interface materials (TIMs) are widely employed to improve the thermal conductivity between the chip and the cooling facilities. In recent years, carbon nanotubes (CNTs) have been proposed as a...
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