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The increasing power consumption of integrated circuits (ICs) enabled by technology scaling requires more efficient heat dissipation solutions to improve overall chip reliability and reduce hotspots. Thermal interface materials (TIMs) are widely employed to improve the thermal conductivity between the chip and the cooling facilities. In recent years, carbon nanotubes (CNTs) have been proposed as a...
A thermo-pneumatically actuated tunable microlens has been developed as a completely integrated system with on-chip actuation and temperature sensing. The focal length of the microlens can be adjusted over a wide range without any external pressure controller. The module consists of a structured silicon chip, a spin-coated PDMS membrane, an optical fluidic chamber, a thermal cavity, and a heating...
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