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In this paper, the finite element model of optical interconnection module is established, and the finite element analysis of the model is carried out under the condition of random vibration loading based on ANSYS software. The distribution law of the stress and strain of the solder joint array is obtained. As an example, the stress and strain of the solder joint array with single factor variation...
The PBGA (Plastic Ball Grid Array) stacked solder bump finite element analysis model was set up, the temperature field analysis and thermal-structural coupling analysis were carried out under power load based on the model. The effects of solder pad size and solder volume on thermal stress distributed in the solder ball were analyzed. The results illustrated that the distribution of temperature in...
The way of stacking solder joint can increase the standoff height of the solder joint, thus improving the fatigue lifetime of solder joints under thermal cycling conditions. Double layer solder joint PBGA package finite element model was established by general-purpose finite element software ANSYS to simulate the stress-strain of solder joints under the thermal cycling loading condition. Base on the...
Three parameters, copper pad material, pad thickness, and bump patterns were chosen as three control factors. By using an L9(34)orthogonal array the copper stud bump solder joints which have 9 different combinations of parameters were designed. The finite element analysis models of 9 copper stud bump solder joints were established by using ANSYS/LS-DYNA, and analyzed the finite element tensile simulation...
As copper wire has excellent thermal conductivity, mechanical properties, low-cost advantages and copper stud bump process is similar the traditional wire bonding process, it makes copper stud bump technology better for medium and low I/O devices, and even in the future, it will expand into midrange I/O packages because it offers a large potential savings in packaging costs with the improved performance...
Three parameters, bonding time, bonding force and ultrasonic energy were chosen as three controlled factors. By using an L9(34)orthogonal array the copper stud bump solder joints which have 9 different combinations of process parameters were designed. The numerical models of 9 copper stud bumps were developed using the ANSYS/LS-DYNA. By using the element of SOLID164 finite element the shaping process...
Four micro-acceleration switches, which have different support beams layout, were designed; four finite element analysis (FMA) models of these micro-acceleration switches were set up. By using the FEA models, the modal analysis and the harmonic response analysis of the micro-acceleration switches were performed. The first 6 order natural frequencies and mode shapes of the four micro-acceleration switcher...
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