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In this paper a novel package structure of chip on board (COB) LED is proposed. Compared with the normal COB with a large number of layer structures, the substrate is removed in the novel. So the LED chip can directly bonded to the radiator, the cooling path is also effectively reduced. The heat generated by the chip can directly dissipate to the outside through the radiator. Then two kinds of finite...
The study focus on the process of metal electroplating on copper substrate to assemble LED chips and molding PET-copper foil to implement a flexible module with LED chips. The process can be divided into two parts,-assembling process and molding process. The LEDs are integrated on copper foil which can deal with the heat dissipation problem effectively. The metal electroplating on copper circuitry...
The study focus on the process of metal electroplating on copper substrate to assemble LED chips and molding PET-copper foil to implement a flexible module with LED chips. The process can be divided into two parts,-assembling process and molding process. The LEDs are integrated on copper foil which can deal with the heat dissipation problem effectively. The metal electroplating on copper circuitry...
The purpose of this work is to conduct the multi-physics simulation analysis of LED luminaire under certain temperature and humidity environment, and to find out the vulnerable spot of the LED luminaire. The coupled modeling of LED luminaire under the temperature and humidity conditions is simulated by ANSYS. Five types of modeling, i.e. thermal and thermo-mechanical modeling, moisture diffusion and...
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