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The brain's cortex is folded and thus can accommodate billions of neurons in an ultra‐compact area. On page 2794, M. M. Hussain and co‐workers demonstrate the world's first state‐of‐the‐art non‐planar 3D FinFET on flexible silicon‐on‐polymer using a CMOS compatible process to enable brain‐architecture‐inspired future ultra‐high performance electronics‐based computer design. This approach can also...
An industry standard 8′′ silicon‐on‐insulator wafer based ultra‐thin (1 μm), ultra‐light‐weight, fully flexible and remarkably transparent state‐of‐the‐art non‐planar three dimensional (3D) FinFET is shown. Introduced by Intel Corporation in 2011 as the most advanced transistor architecture, it reveals sub‐20 nm features and the highest performance ever reported for a flexible transistor.
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