The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The new 3D SRAM integration technology using silicon interposer is proposed. To build this 3D SRAM integration, the design of 3D SRAM architecture is studied. And the electrical simulation of this design scheme is carried out. The maximum crosstalk noise is less than 10% of the power supply voltage. The access speed of 3D SRAM is increased from 37.7ns (sole circuit) to 41.6ns; Under the condition...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.