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This paper proposes a methodology to model an electronic board according to a bottom-up approach. This method is applied to build the model of a synchronous buck DC-DC converter board for conducted emission prediction purpose. The different steps to select the model terminals and the construction of the component and PCB interconnect models are described.
This paper presents a simulation flow for the prediction of the long-term evolution of EMC levels during the life-time of electronic devices or systems. This new requirement is essential to extend the warranty of critical applications operating in harsh environments. The simulation of the evolution of the electromagnetic emission of a switched-mode power supply is given as a validation case.
This paper deals with the modelling of the susceptibility to RF aggression of several input buffers structures implemented in a 90 nm test-chip. Measurement results, model construction and simulation flow are detailed.
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